Roy Rubenstein, writer, Omer, Israel.

I am a contributing editor for the magazines Total Telecom and New Electronics. I also write for the French popular science magazine, Science & Vie. I was a contributing editor for FibreSystems Europe and have also written for the magazines IEEE Spectrum, Telecommunications International, the Economist Intelligence Unit and ScienceBusiness.

I have 16 years' experience researching the telecoms and semiconductor industries. Prior to writing, I was a senior analyst at RHK Inc. covering optical components and communications semiconductors. Coverage topics included optical transport, broadband access silicon and optics, storage, and optical component integration issues.

Before joining RHK, I was a senior editor for the Communications Week International newspaper in London, where I covered next generation networks and emerging technologies. I have also held editorial positions for Electronics Weekly and New Electronics.

Prior to that, I had four years signal processing experience as a DSP R&D engineer at Redifon and Marconi.  I have a Ph.D. in digital communications, an M.Sc. in computer architectures for DSP, and a B.Sc. in electronics engineering from the University of Manchester (U.M.I.S.T.)

In my spare time I paint - click here